---
cve: "CVE-2019-2308"
severity: "LOW"
cvss: 3.1
epss: "21%"
vendor: "Qualcomm, Inc."
kev: false
exploited: false
published: "2019-07-25 17:15:13"
tags: [cve, security, low]
source: tsecurity.de CVE-Dossier
exported: "2026-09-14T04:50:19+02:00"
---

# CVE-2019-2308

> 3.1 LOW

## Beschreibung

User application could potentially make RPC call to the fastrpc driver and the driver will allow the message to go through to the remote subsystem in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24

## Referenzen

- <https://www.codeaurora.org/security-bulletin/2019/07/01/july-2019-code-aurora-security-bulletin>

---
_Exportiert aus dem [tsecurity.de CVE-Dossier](https://tsecurity.de/cve?cve=CVE-2019-2308) · Datenquellen: EUVD (ENISA), NVD, OSV, CISA KEV, FIRST EPSS, Exploit-DB, BSI BITS_