Hitachi Chemical launched mass production of “MCL-HS200,” an advanced functional laminate material for printed wiring boards, with low transmission loss and low warpage properties required for semiconductor packaging substrates used in such fields as fifth-generation mobile communications systems (5G), advanced driver-assistance systems (ADAS), and artificial intelligence (AI) in March. With technological innovations like the Internet of Things (IoT) for electronics-related products, ADAS, and AI making strides in recent years, 5G networks providing high speed, high … More
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