The "Protective Enclosure For Encasing an Electronic Device" patent filed on June 8 and published by both USPTO and WIPO describes multiple versions of shock-absorbing and water-resistant cases for foldable smartphones that come in a clamshell form factor.
"The electronic device may be a foldable device that may include a top device portion and a bottom device portion, and the top device portion and the bottom device portion may be pivotably displaceable about a device hinge axis from or between an open first position and a closed secon...
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