Foveros 2.5D: Advanced packaging across the full spectrum of performance and value | Intel

Foveros 2.5D advanced packaging technology enables more compact chip designs through solutions utilizing silicon interposers and redistribution layers (RDL). Processor designs for increasing workloads must deliver performance and power efficiency in compact designs. Foveros 2.5D offers high bandwidth interconnects, so you can add more functionality without significantly increasing the footprint of the package. Because you can layer advanced nodes on mature nodes, Foveros 2.5D enables more cost-effective chip designs, combining multiple types of dies based on your silicon requirements.



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Foveros 2.5D: Advanced packaging across the full spectrum of performance and value | Intel

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