The leaked bill of materials lists several Qualcomm components for the U.S. iPhone 18 Pro, including the SDX80M modem. The documents also show two separate logic board designs, with one version including a mmWave connector and another built without it.
Apple C2 modem may remain limited to non-mmWave markets
Apple’s current C1 and C1X modems do not support mmWave, and the C2 modem may carry the same limitation. Apple could therefore use Qualcomm hardware in the United States, where carriers rely more heavily on mmWave networks, while using its own modem in regions where that feature matters less.
The documents also suggest that Apple may change SIM support in China. Some prototype configurations mention both eSIM and physical SIM support, which would mark a change from current mainland China models that offer two physical SIM slots.
Apple may also introduce a major packaging change with the A20 Pro chip. The documents point to Wafer-Level Multi-Chip Module packaging, which places the processor and memory side by side and gives Apple more freedom when combining CPU, GPU, Neural Engine, and memory configurations.
iPhone 18 Pro camera may receive a new Sony sensor
Diagnostic data shows that the main camera sensor ID changes from 0x903 on the iPhone 17 Pro to 0x905 on the iPhone 18 Pro. This points to a possible move from Sony’s IMX-903 sensor to a newer custom IMX-905 sensor.
Earlier reports also claimed that Apple plans to add a variable aperture to the main camera, which would give users more control over depth of field and low-light performance. However, the leaked files describe prototype hardware, so Apple can still change these plans before launch.
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